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Program

TEC PROGRAM



  • Scenprogrammet kommer att köras parallellt med expot. Tveka inte att lyssna till de presentationer ni är intresserad av.
  • Lunch serveras mellan 11:00 och 13:00. Dryck och tilltugg serveras i bufféområdet under dagens gång.


Programmet uppdateras löpande

  • 08:55 - 09:00
    Welcome to TEC Lund
    Göran Adlén - Moderator - Evertiq New Media AB
    Att se in i framtiden är inte lätt. Vissa hävdar till och med att det är omöjligt. Men det finns några personer bland oss som kan göra mycket kvalificerade bedömningar av hur framtidens digitalisering och teknologiers kommer att påverka vår liv och arbete. Göran Adlén är en av dessa personer. Han har gjort framtiden till sin specialitet och hjälper dagens verksamheter att vara beredda på morgondagens utmaningar och möjligheter.
  • 09:10 - 09:40
    Practical Digitalization in the Electronics Manufacturing Industry
    Tom Arne Danielsen - Area Sales Manager - Virinco AS
    A common method for quality control in manufacturing of electronics products, is using SPC (Statistical Process Control). SPC is widely used in continuous processes to calculate control limits and to detect out of order process parameters, attempting to design a proactive approach to Total Quality Management. By applying this method in production of electronics you are in reality making assumptions about the manufacturing process that may be wrong. For instance your calculations will be valid if the process parameters you are monitoring are stable.

    The data characteristics of electronics manufacturing extremely dynamic. All aspects of your device under test and the instrumentation are changing continuously which suggests that your process never reaches a stable phase. Stability is a key assumption of conventional statistical methods for Quality Management. Such variations includes changes in components, test programs, firmware, fixtures, instrumentation, operators, environmental factors, and more.
  • 09:50 - 10:20
    Keys to success for mass-production test systems in electronics manufacturing industry
    Daniel Garcia Ortega - Senior Consultant Test & Measurement Systems - DVel AB
    Keeping pace with continuously increasing test performance requirements in a fast moving environment is a challenge. Device performance is constantly pushing the limits of Automated Test Equipment (ATE) system capabilities.

    Building a manufacturing test system that fully cover the test requirements gets more and more complex. Manufacturing cycle time are becoming more rapid, higher levels of yield are desired and the test system footprint on the electronics should be as small as possible. All of this has to be considered.

    This presentation will cover what solution to take for today’s companies to succeed in their testing goals for electronics devices.
  • 10:30 - 11:00
    Problem med försörjningskedjan? Överlevnadsguide för den smarta fabriken
    Michael Ford - European Marketing Director - Aegis Software
    (på engelska): Samtidigt som oron för tillförseln av komponentmaterial fördjupas, tillsammans med den ökande introduktionen av förfalskade material, har fabrikerna rätt i att vara oroliga över hur man ska kunna upprätthålla sin verksamhet på ett smidigt sätt.

    Förra gången som materialbrist skedde var fabrikerna tvungna att sakta ner, eller till och med stanna, på grund av brist på material. När situationen sedan bättrades fann man att nödvändiga material faktiskt hade funnits, men att de var osynliga för ERP. Då över-levererade material blev föråldrade, ommärkta eller nytillverkade, kom förfalskade material upp på kartan och hotade kvaliteten.
  • 11:10 - 11:40
    Möjligheter för outsourcing, kostnadsminskning och optimering av försörjningskedjan i Polen
    Jacek Małecki - Best Supply
    (på engelska): Vilka möjligheter kan Polen erbjuda till företag som arbetar inom elektronikindustrin? Presentationen syftar till att ge insikt om följande ämnen:

    - Lokala leverantörer av icke-komponenter (mekanik, kablar, plast, förpackningsmaterial och etiketter)
    - Lokala EMS:s
    - Etablering av egen enhet i Polen
    - Outsourcing av produktion, FoU, ingenjörsteknik, IT, inköp, produkt livscykelhantering, ekonomi med mera.

    De ovan nämnda ämnena kommer att diskuteras i samband med möjligheter att förbättra lönsamheten och kostnadsminskningen.
  • 13:00 - 13:30
    Renesas Sensor to Cloud
    Peter Ranemyr - Field Application Engineer Nordic - Rutronik Nordic AB
    Presentation of Renesas Synergy toolsuite, enabling developers to rapid success on IOT designs.

    Renesas Synergy Platform, the platform includes a family of ARM based microcontrollers, qualified software, and frameworks to allow for rapid integration of technologies such as Wi-Fi, cellular, and Bluetooth Low Energy.

    To address the daunting task of selecting an IoT Cloud, Renesas has developed a cloud solution that can be used with the Renesas Synergy Platform.

    The Synergy Enterprise Cloud Toolbox provides a reference design and starting point to connect to enterprise clouds such as Microsoft Azure, Amazon Web Services, and Google Cloud Platform. With the Cloud Toolbox, a user can get connected to an enterprise cloud in 10 minutes or less using the provided reference design. Without the Cloud Toolbox reference design, a user could take weeks or even months to create an end to end IoT application.

    Due to existing business relationships or familiarity with the brand of a specific Cloud vendor, some users have preselected an Enterprise Cloud, such as, Microsoft Azure, Amazon Web Services, or Google Cloud Platform for their IoT project.

    Connecting to an Enterprise Cloud for an IoT application does require some additional work on the part of the engineer in order to get started.
  • 13:40 - 14:10
    High-power device assembly: A reinforced matrix solder preform solution for bondline control & increased reliability
    Graham Wilson - Senior applications engineer - Indium Corporation
    (på engelska): A solder preform is the typical interconnect solution between a power component and the substrate. With increasing power densities, it is becoming clear that a uniform bondline control between the power device and substrate has a direct link to mechanical reliability. This is especially true in RF communication (radio modules, 5G and beyond) and automotive power modules (48V mild hybrid, HEV/EV platforms). Current techniques to achieve a uniform bondline include; stamped bumps or stitched wire bonds on the substrate, thus by providing a standoff and preventing tilt. The reinforced preform is solder with a composite metal matrix that’s inbuilt with the desired standoff for bondline control.

    This study looked at bondline coplanarity, reliability and the process cost of ownership for a substrate (Cu & AlN) soldered to a baseplate (Cu & AlSiC) with (a) Standard solder preform with no bondline control; (b) Solder preform + substrate with stamped bumps; (c) Solder preform + stitched wire bonds on the substrate; (d) Reinforced Matrix solder preform. The assembly was temperature cycled for 2 regimes; (a) -50/+150C; 1000 cycles; (b) -40/+125C; 1000 cycles. Samples were analysed by scanning acoustic microscopy to check for delamination. The solder preform with no bondline control exhibited delamination @ 600 cycles. For the samples that used the stitched wirebonds and the stamped bumps, cracking and delamination was seen @ 800 cycles. The reinforced matrix solder preform did not show any delamination at 1000 cycles. The test was extended to 2000 cycles, and the reinforced matrix solder preform did not exhibit delamination or evidence of thermal fatigue.

    The increased reliability of the reinforced metal matrix solder can be attributed to (i) better bondline control and the least coplanarity deviation, because of the matrix across the entire solder area (ii) the solder Reinforcement by the metal matrix thus enhancing creep resistance and significant improvement in thermal cycling performance.

    The increased reliability of the solder with metal matrix is because of 2 reasons – (i) uniform bondline control across the entire area of the solder joint because of the presence of the matrix vs bondline control only at the 4 corners with the stitched Al wirebond technique; (ii) the metal matrix reinforces the solder matrix thus improving creep resistance that results in significantly improved thermal cycling performance with no solder delamination.

    In addition to increased reliability, there was no change in the assembly process parameters for the reinforced matrix preform with comparable wetting and voiding (<2%), when compared to a standard solder preform. By eliminating additional process steps associated with the wirebond stitch and trim technique, the reinforced matrix preform achieved a lower cost of ownership.
  • 14:20 - 14:50
    Simulations to improve performance and reliability in electronic applications
    Mikael Fredenberg - Senior Technical Sales Specialist - COMSOL AB
    Today’s powerful computers in combination with simulation software can accurately predict reliability issues as well as optimize performance of electrical components and systems. This significantly reduces the costly and time-consuming need for prototyping and testing.

    By using heat transfer and fluid flow (CFD) simulations, the designer can predict temperature distribution to avoid overheating. In the simulation, appropriate materials and cooling solutions can be applied. The need to model thermal management and life-time of batteries is also increasing rapidly.

    Structural simulations are frequently used to study mechanical stress and strain. One common example is the modeling of thermal cycling and life-time of surface mounted components on printed circuit boards.

    Finally, simulation models are widely used in industry to study and optimize the electromagnetic compatibility/interference (EMC/EMI) and performance of various components such as antennas, transmission lines, transformers, inductors, resistors, capacitors, connectors and cables.

    This presentation will showcase how the electronics industry benefits from using modeling and simulation. A number of different applications will be demonstrated and success stories from leading companies will be presented too.
  • 16:00
    TEC Lund slutar

Talare

Working for © Aegis Software provides Michael Ford the opportunity to apply his 30+ years of experience of the electronics assembly manufacturing industries, to bring both business and technology solution innovation that satisfies evolving needs in the market.

With a degree in Electronics from the University of Wales, Michael started his career with Sony in the UK, creating and developing software solutions as he acquired a broad range of manufacturing knowledge. Spending eight years working in Japan gave Michael the opportunity to expand his experience and apply his innovations on a global enterprise scale.

Today, Michael is an established thought leader for Industry 4.0 and Smart factories. Michael is an active contributor to industry standards with the IPC, including his position as chair of the IPC-1782 traceability standard, and he is currently the leader of the IPC CFX content sub task-group.


Wilson Graham joined © Indium Corporation in 2007 as an Applications Engineer. For 10 years, he has provided European-based comprehensive technical advice in the selection, use, and application of Indium Corporation’s solder materials. His previous experience includes Pb-free implementation, production engineering, RoHS compliance, and component finishes.

Today Wilson travels extensively, representing Indium Corporation at customer and industry events, and conducting customer and sales channel partner site visits.


Tom Arne Danielsen, Area Sales Manager for Virinco AS, has several years of experience from the automated manufacturing test segment, working both technical and sales roles at National Instruments. His current role at Virinco is helping OEM customers around the globe with their continuous improvement initiatives, through proactive use of manufacturing test data across their organisation.


Mikael Fredenberg works as senior technical sales specialist at COMSOL. Before joining COMSOL in 2012 he was one of the founders of a start-up company, developing a novel electroplating technology for the electronics manufacturing industry. He worked there as the technical manager for 10 years. He holds a Master of Science in Chemical Engineering from Lund University and he is a specialist within heat and mass transfer as well as electrochemistry.


Daniel Garcia Ortega is a Senior Consultant in Test & Measurement System at DVel AB. He is focused on providing the best solutions for Test Systems to DVel’s customers and conducting them to success thanks to his background and knowledge in Automated Test.

He started his career as an Application Engineer in National Instruments in Italy, finding creative and effective solutions to their customer’s applications. Afterward he moved to Vodafone Automotive as an End-of-Line Test Engineer, where he focused on the Automated Manufacturing test in the Automotive Sector. Daniel is a Certified LabVIEW Architect as well as a Certified TestStand Developer.

Moderator

Att se in i framtiden är inte lätt. Vissa hävdar till och med att det är omöjligt. Men det finns några personer bland oss som kan göra mycket kvalificerade bedömningar av hur framtidens digitalisering och teknologiers kommer att påverka vår liv och arbete. Göran Adlén är en av dessa personer. Han har gjort framtiden till sin specialitet och hjälper dagens verksamheter att vara beredda på morgondagens utmaningar och möjligheter.

Göran Adlén är civilekonom, creative director och reklammakare som har arbetat med flera internationella varumärken. I över 13 år var han lärare i marknadsföring och marknadsanalys på IHM Business School, men är sedan 16 år tillbaka en av Sveriges mest efterfrågade föreläsare, utbildare och rådgivare med över 3 000 genomförda föreläsningar i bagaget.

Kontakt

Försäljning
Peter Lithander
+46 70 377 99 50
Programansvarig
Anke Schröter
+46 73 844 90 09
Projektledare
Henrik Björsell
+46 70 371 90 09