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Sponsrat innehåll från Kontron

COM-HPC® sets a new standard for embedded High Performance Computing

The new COM-HPC® standard will take COMs to a whole new level while being complementary to the widely used COM Express®
Available from 2021, the first COM-HPC® modules will effectively future-proof the concept of standardized modular embedded computing. The new standard offers almost limitless potential for scalability, compute performance, connectivity, and high-speed communications. There will be five form factor modules: Sizes A, B, and C relate to three embedded COM-HPC®/Client modules for use in high-end embedded applications. These will focus on powerful graphics and connect 2 x MIPI-CSI (Mobile Industry Processor Interface – Camera Serial Interface) for imaging tasks including those required for medical equipment, autonomous vehicles, and surveillance. Sizes D and E are for the two COM-HPC®/Server modules intended mainly for high performance edge server class applications such as AI and analytics, to manage high data volumes involving high speed transmission and real-time processing.
  • COM-HPC® specification allows Server and Client pin-out on all five sizes
  • Legacy features have been reduced as much as possible (e.g. no LVDS, no HDA, no VGA, no LPC)
  • Significant increased compute performance enabled by 250 - 300W overall power envelope compared to typical maximum of 80W of COM Express
  • Increased transmission and connectivity performance enabled by new module to carrier board connector: PCIe Gen4/5 and 10Gb/25Gb Ethernet compliant, offered in 5mm and 10mm stack heights and providing 2 x 400 pin out connection - doubling the total number of PCIe lanes supported (from 32 for COM Express Type 7 to 64 for COM-HPC®/Server)
  • Data rates of up to 32 Gbit/s per lane via PCIe (Gen 5) compared to typical 8 Gbit/s with COM Express
  • For high-end edge server applications, COM-HPC®/Server modules will substantially increase overall connectivity performance: up to 8 x 25 Gb Ethernet lanes and 64 PCIe lanes (Gen 4/5) enabling data transfer rates of up to 255 Gbit/s. There will also be 2 x USB 4 interfaces which will nearly double the rates of USB 3.2
  • COM-HPC®/Server modules will support up to 1TByte of RAM using the eight DIMM sockets provided
  • System management interface will enable centralized control and scheduling for predictive maintenance; BMC (Board Management Controller) on carrier and MMC (Module Management Controller) on module enables sensor monitoring/alerting and providing out of band remote manageability
  • For maximum product lifetime, COM-HPC® modules will be easily upgradable and interchangeable as application performance needs change and respond to new technology developments

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2021-04-15 09:56 V18.15.43-2