Qualcomm-Powered Long-Range Communication for Robotics&Drones

Robonode, a Qualcomm Dragonwing™ solution that delivers long-range, low-latency, mission-critical communications for Robotics, Drone and Industrial equipment. It’s an all in one, plug and play communications system that incorporates powerful CPU, DSP processing capabilities along with robust low-latency Wi-Fi communications for broadcasting over long distances.

Local AI Voice Assistants Without Cloud Dependency: SYNAPTICS Delivers a Powerful On-Device Solution

SYNAPTICS has released a development environment on GitHub that enables voice assistants to run locally—without requiring a cloud connection. This is made possible by the powerful architecture of the SYNAPTICS SL family, particularly the SL1680 and SL1640 models, which feature an integrated NPU and benefit from the ASTRA SDK software environment and SynAP Tool Kit

Snapdragon S3 Gen 1 Sound PlatformGen3: Powerful Bluetooth Audio SoCs for Superior Sound Quality

The Snapdragon S3 Gen 1 Sound platform is designed formid-range Bluetooth audio devices, delivering significant advancements in audio quality. For the first time, the platform allows customers to access QUALCOMM’s Extension Partner Program, enabling integration of third-party audio solutions. This gives S3 Gen 1 users a unique opportunity to differentiate their products in a competitive market.

SYNAPTICS ASTRA™ Family of SoCs & SDK for AI-Native Embedded Compute

Founded to advance the state-of-the-art in artificial neural networks (ANNs), SYNAPTICS has compiled a rich portfolio of AI technologies that it infuses across all its product lines, including the fast-growing Edge AI segment of the IoT. Early on, the three key elements of every IoT platform were emphasised: sensing, processing, and connectivity.

Rochester's Obsolescence Solutions Embrace a Wide Range of Products

The diverse challenges facing 5 distinct product segments. When it comes to electronics, most designs will involve multiple semiconductor devices. With this point in mind, Rochester Electronics’ goal is not to offer a single solution for an obsolete device, but instead provide a range of solutions covering the many mature devices likely found in designs.

Smart Camera, AI and Robotics Software Resources for QUALCOMM System on Chip Platforms

QUALCOMM’s IOT roadmap offers a range of powerful and highly integrated system on chip devices for a broad set of IOT use cases and applications. These SoCs incorporate several subsystems into a single device from 5G and LTE cellular modem, multi-core CPU (up to 8 cores), GPU and AI capable DSPs to dual high-resolution camera ISP, sensor, audio and security subsystems. In order to enable customers to realise innovative computer vision, AI and Robotics products quickly, a comprehensive suite of robust software development kits and libraries are needed. This article will focus on the software resources available for QUALCOMM’s SOC roadmap.

Products and Solutions for Consumer and Industrial Wearables by Atlantik Elektronik

Are you looking for a new, unprecedentedly high performing wearable? Atlantik helps to create powerful, innovative, stylish devices and experiences using our full portfolio of wearable solutions. This includes an extensive set of hardware, software, and development tools as well as the capability to combine selected parts and create a complete solution. Designed to deliver advancements in size, power, sensor integration, connectivity, battery life, and performance, our wearable platforms enable the next generation of smart wearable devices.

Smart Camera, AI and Robotics Software Resources for QUALCOMM System on Chip Platforms

QUALCOMM’s IOT roadmap offers a range of powerful and highly integrated system on chip devices for a broad set of IOT use cases and applications. These SoCs incorporate several subsystems into a single device from 5G and LTE cellular modem, multi-core CPU (up to 8 cores), GPU and AI capable DSPs to dual high-resolution camera ISP, sensor, audio and security subsystems. In order to enable customers to realise innovative computer vision, AI and Robotics products quickly, a comprehensive suite of robust software development kits and libraries are needed. This article will focus on the software resources available for QUALCOMM’s SOC roadmap.

QUALCOMM’s SoC Roadmap Meets the Diverse Needs of the Edge IOT Market

Edge Computing or Edge IoT is a recent development in the IoT market that is enjoying explosive growth in recent time. These terms refer to a recent development in distributed computing whereby computers, cameras and sensor processing systems are deployed in the same physical space where machines, robots and people connect and interact with the digital world.

Accelerating time to market for Robotics and Intelligent Camera products with Thundercomm SOM’s

In Europe like the rest of the world we are witnessing an explosion in robotics and automation technologies adoption. Intense competition and an aging workforce across a broad set of industries from manufacturing to farming to logistics and retail is forcing companies to incorporate these systems to improve efficiency and speed up productivity.

COM Express Type 6 and COM-HPC Client

A New Generation of Embedded Processors It’s a new era for high-end embedded processors that are now available on two Computer-on-Module form factors: The brand-new COM-HPC® Client and COM Express® Type 6. With the emergence of the 11th Gen Intel® Core® processor generation (codenamed Tiger Lake), developers now have the ability to choose the most appropriate form factor that best suits their project requirements.

Low-power flagship for artificial intelligence

congatec is expanding its SMARC platform with a new module with an NXP i.MX 8M Plus processor especially for embedded AI applications. Thanks to the extensive ecosystem with application-ready 3.5-inch carrier board, Basler cameras, and AI software stack, fast proof of concept is possible.

Industriella elektroniska komponenter från Panasonic Industry

A highly reliable performance boost for the edge

The new Intel Atom® x6000E Series, Intel Celeron® and Pentium® N & J processors (code name Elkhart Lake) impress with twice the graphics speed of their predecessors and 50% more multi-thread performance on up to 4 cores. congatec is now making these processors available on the 2.5-inch Pico-ITX form factor, leveraging their industrial quality for the most reliable performance boost possible.

CODICO – A Market Enabler For Vehicle Electrification

Currently car manufactures are working intensely to develop and launch electric vehicles. In parallel governments in many countries are offering subsidizes for installing charging equipment. Furthermore, a charging standard has been developed and adopted by most car manufacturers. A vital part of a charging system is the communication between the charging station and the vehicle. This communication is based on power line communication (PLC) over the already existing charging cable.

Small but impressive

The 8X version of the NXP i.MX 8 processor has an extremely low power consumption, is robust and comes with many functional safety features. congatec supports it on the SMARC 2.0 and Qseven module standards. Such modules offer ARM developers greater design security and easier implementation of the processing core despite increasing complexity.

Varför kan komponentval - ge huvudvärk ?

Increased demands on components for Medtech Having knowledge of regulations, norms and, not least, future demands on performance, function and safety can save you both time and money in the development of Medtech products.

Kontron introduces COMe-cVR6 (E2) Module with new AMD Ryzen™ Embedded V1000 Processor

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), introduces its new COMe-cVR6 (E2) Module in the COM Express® Compact Type 6 form factor. It is based on the new AMD Ryzen™ Embedded V1000 processor, which sets the benchmark for high-end embedded computer modules. The COM Express® Compact module's smaller form factor significantly saves space in comparison to most comparable solutions, allowing developers to create more compact designs with higher performance. Variants of the COMe-cVR6 (E2) are also resitant to vibration and shocks thanks to their permanently soldered memory, just as all other components, such as voltage dividers, capacitors, and controllers are selected for highest resistance to environmental stresses. The new COM Express® module is particularly suitable for applications in harsh environments, medical or industrial image processing systems, as well as complex automation systems.